Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and skill to meet the accelerating global demand for semiconductors. The Disaggregation Manufacturing Operation (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia (PGDM: Penang Disaggregation Manufacturing), increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.
The PGDM (APF26) Integration Manager will lead the PGDM (APF26) Integration team for the DMO factory startup in Malaysia. As such, this assignment will require an expat assignment in Malaysia, working alongside other expats and local hires to ramp the new packaging capabilities.
Successful candidate will report directly to the Plant Manager and be part of PGDM Staff. PGDM (APF26) Integration Manager will be responsible for working across the Passive Interposer/Through Silicon Via (TSV), Wafer Level Assembly/Controlled Collapse of Chip Connection (WLA/C4), and Die Prep/ Die Sort/Wafer Sort/Die Aggregation (DP/DS/WS/DA) facilities within PGDM, along with the reference sites, Corporate Quality Network (CQN) and Assembly Test Manufacturing (ATM) to transfer, qualify, and certify the factory. Post certification, the Integration Manager will be expected to maintain process synchronization, coordinate insertion of new processes and drive yield and parametric improvement projects, working closely with embedded Yield organizations.
As a senior manager, you will be expected to set priorities for the Integration team, work effectively across organizational boundaries, develop employees, and manage performance. You will be responsible for ensuring a safe, inclusive work environment while meeting your area and factory commitments. It will also necessary to establish strong relationships with the other DMO High Volume Manufacturing (HVM) sites, Oregon Wafer Level Assembly and New Mexico Development and Manufacturing (OWLA and NMDM ) and with the Malaysia Assembly Test Manufacturing (ATM) sites.
The ideal candidate should exhibit the following behavioral traits:
Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to task.
Inspire a team to achieve desired behaviors and objectives.
Role model Intel culture and values.
Motivated self-starter that can work independently as well as in a team environment.
This person should possess a self-driven personality with proven leadership skills and driving the business forward while fostering a One Intel culture.
Flexibility and maturity in facing uncertainties and changing priorities.
Commitment to aggressive goals and win with a can-do attitude.
You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.
Possess a Bachelor's, Master's, or PhD degree in Electrical, Chemical, Mechanical Engineering, Physics, Chemistry, or Engineering discipline related to semiconductor manufacturing.
10+ years of experience in the semiconductor industry in process engineering or Integration.
5+ years as first or second level manager in prior 8 years, managing teams comprised of new and/or senior engineers
Prior role leading process transfer, in either a transfer or receiving capacity
Strong working knowledge of device physics and process technology.
Prior integration experience with upper back-end (BE) and assembly processes including yield loss and reliability failure modes
Understanding of upper BE and assembly certification requirements and procedures
Experience building a new organization, including hiring and training
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here:
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.